GOWE ESD Infrared Ceramics Preheater BGA IR Preheating Station Digital Desoldering Station for PCB Component Electronic image-1
GOWE ESD Infrared Ceramics Preheater BGA IR Preheating Station Digital Desoldering Station for PCB Component Electronic image-2
GOWE ESD Infrared Ceramics Preheater BGA IR Preheating Station Digital Desoldering Station for PCB Component Electronic image-1
GOWE ESD Infrared Ceramics Preheater BGA IR Preheating Station Digital Desoldering Station for PCB Component Electronic image-2
GOWE

GOWE ESD Infrared Ceramics Preheater BGA IR Preheating Station Digital Desoldering Station for PCB Component Electronic

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Description
ESD Infrared Ceramics Preheater BGA IR Preheating Station Digital Desoldering Station for PCB Component Electronic; 1. Best Quality; 2. Good Packing & Fast Shipping; Features: Import infrared ceramic heating element , heating , high efficiency , long life. Built-in thermometer, convenient detection of PCB temperature . Sensor closed loop PID control, temperature accuracy and stability . Can be used for preheating the circuit board , and other needs uniform heating of the whole process .Anti -static design . Specifications: Heating power 600W; Heating an area 130X130mm; Hugh material ceramic heating element heating; K-type thermocouple temperature sensor; Temperature range 50 Celsius degree - 350 Celsius degree; Thermometer measuring range 0 - 400 Celsius degree Ambient temperature 0 - 40 Celsius degree; Temperature stability ¡À 1 Celsius degree; Dimensions 255 (L) X200 (W) X63 (H) mm; Weight About 2.5Kg; Application: electrical and electronic communications and maintenance of industrial board PCB board preheat heated components desoldering Operation: A: Preheat elements ( with the desoldering tool ); 1 Plug in the power plug on the PCB board clip will be processed components on the center of preheated Taiwan; 2 According to the size of the PCB thickness element set temperature , turn on the power switch, the preheating station that will be immediately warmed to the temperature you posed , and then a constant temperature B: Remove the Components; A good set up to be processed PCB, the components to be removed on the preheat coil center; 2 According to the size of the circuit board components on the PCB thickness tin melting , the temperature set;

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